Hello everyone,
I’m currently integrating a Jetson AGX Orin Developer Kit into a mobile robotic platform similar to a drone using a Stereolabs stereo camera system (ZED).
Since the system will operate in real-world environments, I’m looking for practical engineering advice on how to properly protect the Jetson hardware under the following conditions:
-
Dust exposure (outdoor or semi-industrial environments)
-
Mechanical vibrations (motors, movement, impacts)
-
Occasional moisture or light water exposure (not full waterproof submersion, but splashes / humidity)
My main concerns are:
-
Preventing dust accumulation inside the carrier board and connectors
-
Avoiding connector loosening due to continuous vibration
-
Ensuring thermal stability if the system is placed inside an enclosure
-
Protecting the PCB from humidity or condensation without damaging heat dissipation
-
Maintaining reliable operation of the ZED camera + Jetson pipeline in mobile conditions
I would really appreciate any recommendations on:
-
Enclosure types (IP rating suggestions, materials, designs)
-
Vibration isolation strategies for the AGX Orin module
-
Whether conformal coating is safe/recommended for this platform
-
Cooling strategies when using sealed or semi-sealed housings
-
Real-world setups used in drones or mobile robotics with ZED cameras
If anyone has experience deploying Jetson AGX Orin in harsh mobile environments, I’d be very interested in hearing how you solved these issues in practice.
Thanks in advance!